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The New Intel® Xeon® Platinum 9200 Series Processors

The New Intel® Xeon® Platinum 9200 Series Processors

    Performance Optimized for Compute Density

    The Intel® Server System S9200WK product family is a purpose built, performance-optimized data center block ideal for use in High Performance Computing and Artificial Intelligence applications. Designed for Intel® Xeon® Platinum 9200 series processors, with up to 24 DDR4 DIMM slots per compute module, the S9200WK family maximizes processor and memory bandwidth to provide leadership performance for the most demanding compute use requirements.


    Intel® Xeon® Platinum 9200 Processors Advanced Performance

    • Leadership CPU performance per socket with Intel’s highest core count, Intel® Xeon® Platinum 9200 processors

    • Double the memory bandwidth for memory-intensive workloads with 12 memory channels per CPU, 24 memory channels per compute module

    • New Intel® Deep Learning Boost Instructions for data analytics greatly accelerates inference performance

    • Multi-Chip packaging optimized for density and performance


    Density Optimized 2U Rack Server with Air-Cooled and Liquid-Cooled Options

    • Up to 4 compute modules per 2U chassis which can support multiple compute module types in a single chassis

    • 2 CPU compute module design with advanced cooling technology for high flow rate air or liquid cooled for CPUs, VRs, DIMMs, and memory VRs for high heat capture ratio

    • Up to 350W processor TDP for high performance workloads in a 2U air-cooled chassis

    • Up to 2 x16 PCIe slots in 1U compute modules, up to 4 x16 PCIe slots in 2U compute modules for network expansion options

    • Support for 2x M.2 SATA/NVMe storage devices per 1U compute module, up to 2x M.2 SATA/NVMe and 2x U.2 NVMe storage devices per 2U compute module

    • Hot-swappable compute modules, storage¹, fans, and power supplies

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TECHNICAL SPECIFICATIONS

TECHNICAL SPECIFICATIONS

     

      

     Form Factor​

     2U rack enclosure; Up to 4 independent warm-swap compute modules​ 

     CPU​

     Intel® Xeon® Platinum 9200 Processors

     Memory​

     DDR4 2933 MT/s DIMMS, up to 96x DIMMs per DCB (24 DIMMs per compute module) @ 1DPC Supports 8GB to 128GB DIMM options, number and capacity configurable​

     Storage​

     Up to 8x M.2 SSDs per DCB with 1U compute modules; Up to 4x M.2 SSDs & 4x hot-swap U.2 NVMe SSDs with 2U Compute Modules M.2 and U.2 number and capacity configurable​

     Power Supply​

     3x hot-swap CRPS 2100W (Platinum) or 1600W (Titanium) PSUs​

     Ethernet​

     Integrated 1Gbase-T RJ45 (two ports per compute module), Optional shared 1Gbase-T RJ45 management port chassis card​

     Cooling​

     Available with high flow rate air-cooling or integrated liquid-cooling options​

     I/O​

     2 x16 Gen3 PCIe* slots per 1U compute module; 4 x16 Gen3 PCIe slots per 2U compute module for high-speed networking support​

     Manageability​

     Dedicated, consolidated Management Module​

     Security & Serviceability​

     TPM 2.0 (optional); Hot-swap/redundant fans, and PSUs; light path diagnostic LEDs​


INTEL® XEON® PLATINUM 9200 PROCESSORS

INTEL® XEON® PLATINUM 9200 PROCESSORS

     

     CORES

     BASE FREQUENCY​

     MAX TURBO FREQUENCY​

     L3 CACHE​

     # OF UPI LINKS​

     POWER​

     9282

     56 

     2.6 GHz​

     3.8 GHz​

     77 MB​

     4

     400W​

     9242​

     48

     2.3 GHz​

     3.8 GHz​

     71.5 MB​

     4

     350W​

     9222​

     32

     2.3 GHz​​

     3.7 GHz​

     71.5 MB​

     4

     250W​

     9221​

     32

     2.1 GHz​​

     3.7 GHz​

     71.5 MB​

     4

     250W​


COMPUTE MODULES

COMPUTE MODULES

     

     

     

     

      

      

     Component​

    1U Half-Width Liquid-Cooled Compute Module​

    2U Half-Width Liquid-Cooled Compute Module​

    2U Half-Width Air-Cooled Compute Module​ 

     CPU​

     Intel® Xeon® Platinum 9200 processors with up to 56 cores 400W TDP

     Intel® Xeon® Platinum 9200 processors with up to 48 cores 350W TDP

     Memory​

     DDR4 2933 MT/s DIMMS, up to 24 DIMMs per compute module @ 1DPC; Supports 8GB to 128GB DIMM options, number and capacity configurable​

     Storage​

     2x M.2 SATA/NVMe SSDs 80 or 110mm​

     2x M.2 SATA/NVMe SSDs 80 or 110mm & 2x U.2 NVMe hot-swap SSDs, optional RAID 0 & 1 support available on U.2 SSDs​

     DCB Configuration​

     2U/4N liquid-cooled​

     2U/2N liquid-cooled​

     2U/2N air-cooled​

     I/O​

     2x Integrated 1Gbase-T RJ45 & 2 x16 Gen3 PCIe slots​

     2x Integrated 1Gbase-T RJ45 & 4 x16 Gen3 PCIe slots​

     Debug Support​

     Dedicated port for VGA, serial, & 2 USB 2.0 port connectivity​

     Cooling​

     Direct-to-Chip Liquid-Cooling for CPUs, VRs, DIMMs, and Memory VRs​

     High-Flow Air-Cooling​

CHASSIS

CHASSIS

     

      

      

     Component​

     2U Front I/O standard-width air-cooled chassis with included rail-kit​

     2U Front I/O standard-width liquid-cooled chassis with included rail-kit​

     Supported Configurations​

     4x 1U Half-Width Compute Modules; 2x 2U Half-Width Compute Modules; 2x 1U Half-Width Compute Modules & 1x 2U Half- Width Compute Modules​

     Cooling​

     3x 60mm fans & 2x 80mm fans​

     3x 60mm fans & integrated liquid-cooling manifold (SCG06 external connectors, CGD03 internal connectors)​

     Power Supplies​

     3x hot-swap CRPS 1600W (Titanium) or 2100W (Platinum) PSUs​

     3x hot-swap CRPS 2100W (Platinum) PSUs​

     Options​

     Optional shared 1GBase-T RJ45 management port chassis card​